Manufacturer Part Number
EP3SL200F1152I3
Manufacturer
Intel
Introduction
The EP3SL200F1152I3 is part of Intel's Stratix® III L series, designed for embedded FPGA applications, offering high density and performance.
Product Features and Performance
High-density FPGA: 200,000 logic elements/cells and 8,000 LABs/CLBs.
Large RAM capacity: Total RAM bits of 10,901,504.
Extensive I/O options: 744 I/O pins.
Flexible voltage supply: 0.86V to 1.15V.
Surface mount technology: For efficient PCB integration.
Wide operating temperature range: -40°C to 100°C (TJ).
Product Advantages
Offers high integration capability for complex designs.
Supports extensive data storage and retrieval with its large RAM.
Provides flexibility in interfacing with various peripherals due to numerous I/O options.
Compatible with low-voltage applications.
Suitable for harsh environments due to its wide temperature range.
Key Technical Parameters
Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 200000
Total RAM Bits: 10901504
Number of I/O: 744
Voltage Supply: 0.86V ~ 1.15V
Operating Temperature: -40°C ~ 100°C (TJ)
Package: 1152-BBGA, FCBGA
Quality and Safety Features
Manufactured by Intel, ensuring high quality and reliability.
Robust package (1152-BBGA, FCBGA) designed for optimal performance in varying conditions.
Compatibility
Designed for surface mount technology, facilitating integration into various PCB designs.
Application Areas
Ideal for high-performance computing, networking, and communications infrastructure.
Suitable for industrial, automotive, and aerospace applications requiring high density and reliability.
Product Lifecycle
Obsolete: Users should consider this in their long-term design strategies.
Availability of replacements or upgrades should be confirmed with the manufacturer.
Several Key Reasons to Choose This Product
High logic density allows for the implementation of complex algorithms and processes.
Versatile in dealing with massive data through its ample RAM.
Flexible I/O count supports a wide range of peripheral devices.
Broad operating temperature range makes it suitable for extreme conditions.
Backed by Intel's reputation for quality and performance in semiconductor manufacturing.