Manufacturer Part Number
EP3C25F324I7N
Manufacturer
Intel
Introduction
Intel's EP3C25F324I7N is part of the Cyclone® III FPGA series, designed for performance-driven, power-conscious embedded applications.
Product Features and Performance
FPGA Device with 1539 LABs/CLBs
24,624 Logic Elements/Cells
608,256 Total RAM Bits
215 I/O Pins
Low power consumption
High-density integration for complex designs
Supports various logic design implementations
Product Advantages
Robust performance at low power levels
Suitable for high-volume applications due to cost-effectiveness
Reliable operation in extreme temperature conditions
Key Technical Parameters
Number of LABs/CLBs: 1539
Number of Logic Elements/Cells: 24624
Total RAM Bits: 608256
Number of I/O: 215
Supply Voltage: 1.15V ~ 1.25V
Mounting Type: Surface Mount
Operating Temperature Range: -40°C ~ 100°C (TJ)
Quality and Safety Features
Extensive quality testing to endure rigorous use
Over-temperature protection for device longevity
Compatibility
Designed for multipart interfacing, compatible with numerous industry-standard peripherals and interfaces
Adapter-friendly BGA package for superior PCB real estate management
Application Areas
Automotive systems
Industrial automation
Military and aerospace technology
Consumer electronics
Telecommunications
Product Lifecycle
Active product stage
No near-term discontinuation anticipated
Continuous manufacturer support with potential for replacements or upgrades
Several Key Reasons to Choose This Product
Proven Intel quality and reliability for mission-critical applications
Flexible and adaptable architecture for a wide range of uses
Competitive edge in power consumption and operational efficiency
Support for high-density designs reduces overall system costs
Access to Intel's comprehensive technical resources and support network