EP3C25F324A7N - Intel

Manufacturer Part Number

EP3C25F324A7N

Manufacturer

Intel

Introduction

The EP3C25F324A7N is part of Intel's Cyclone® III FPGA series, designed for high-density, low-power applications.

Product Features and Performance

Embedded FPGA from Cyclone® III series

Offers 24,624 logic elements/cells

1,539 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs)

Total of 608,256 RAM bits for memory needs

215 available Input/Output pins

Supports surface mount technology

Extended operating temperature range from -40°C to 125°C

Product Advantages

High performance with minimal power consumption

Optimized for cost-sensitive applications

Offers a balance between density and functionality

Robust in harsh temperature environments

Key Technical Parameters

Number of LABs/CLBs: 1539

Number of Logic Elements/Cells: 24624

Total RAM Bits: 608256

Number of I/O: 215

Voltage - Supply: 1.15V ~ 1.25V

Operating Temperature: -40°C ~ 125°C (TJ)

Quality and Safety Features

Extended temperature range for reliability under thermal stress

Compatible with lead-free processes

Compatibility

Supports 324-pin Fine-Pitch BGA packaging

Industry standard I/O voltage levels

Application Areas

Suitable for automotive, industrial, and consumer electronics

Ideal for applications requiring embedded processing, such as control systems

Product Lifecycle

Active product status

Compliant with current technological standards and future design requirements

Reasons to Choose This Product

High integration capability decreases overall system costs

Low power consumption enhances system efficiency

Robust temperature range supports reliability in extreme conditions

Intel's reputation for quality and support ensures product longevity

Large number of user I/Os enhances versatility in application

Part of the widely adopted and supported Cyclone® III series