Manufacturer Part Number
EP3C25U256I7N
Manufacturer
Intel
Introduction
The EP3C25U256I7N is part of Intel's Cyclone® III series, offering a versatile FPGA solution ideal for high-volume, cost-sensitive applications.
Product Features and Performance
Embedded in the Cyclone® III series, designed for high performance with low power consumption.
Features 1539 Logic Array Blocks (LABs) and 24624 Logic Elements/Cells, enabling complex logic functions.
Contains 608256 Total RAM Bits for efficient data storage and manipulation.
Supports up to 156 I/O pins, enhancing connectivity options.
Operates on a power supply voltage ranging from 1.15V to 1.25V.
Surface Mount technology for compact and robust PCB designs.
Functional within an operating temperature range of -40°C to 100°C, ensuring reliability under various environmental conditions.
Product Advantages
Low power consumption combined with high-performance capabilities.
Ample logic elements and RAM bits to support complex designs and functionalities.
Wide operating temperature range enhances the product's robustness in harsh environments.
High I/O pin count provides flexibility in interfacing with other components.
Key Technical Parameters
Number of LABs/CLBs: 1539
Number of Logic Elements/Cells: 24624
Total RAM Bits: 608256
Number of I/O: 156
Voltage Supply: 1.15V ~ 1.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 256-LFBGA
Supplier Device Package: 256-UBGA (14x14)
Quality and Safety Features
Manufactured by Intel, ensuring high standards of quality and reliability.
Designed to operate reliably within a wide range of environmental conditions.
Compatibility
The product's surface mount package and standard voltage requirements allow for compatibility with a wide range of PCB designs and power supplies.
Application Areas
Ideal for telecommunications, automotive, consumer electronics, and industrial applications requiring high performance and reliability.
Product Lifecycle
Currently marked as active, indicating ongoing manufacture and support.
No immediate indication of discontinuation, ensuring availability for new designs and projects.
Several Key Reasons to Choose This Product
High density of logic elements and RAM allows for the implementation of complex algorithms and data storage features.
Low power consumption helps to maintain efficiency and reduce heat generation in end applications.
Wide range of operating temperatures ensures performance stability across various environmental conditions.
Intel's reputation for quality and reliability adds an extra layer of assurance in the product's performance and longevity.
Versatility in application makes it suitable for a diverse range of high-volume, cost-sensitive projects.
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