Manufacturer Part Number
BM23FR0.6-50DS-0.35V(51)
Manufacturer
Hirose
Introduction
This Hirose BM23 series rectangular connector array is an edge-type, mezzanine (board-to-board) connector designed for high-density, surface-mount applications. It features a low-profile design with a mated stacking height of 0.6mm, making it ideal for compact, space-constrained electronic devices.
Product Features and Performance
50-position, 2-row design with 0.35mm pitch
Surface-mount mounting for easy assembly
Solder retention feature for secure attachment
Gold-plated contacts for reliable, long-lasting connections
Height above board of 0.61mm for low-profile integration
Product Advantages
Compact, space-saving design
High-density and high-reliability interconnect solution
Ease of assembly with surface-mount installation
Key Reasons to Choose This Product
Optimized for use in slim, space-constrained applications
Robust and durable construction for long-term reliability
Excellent signal transmission and electrical performance
Quality and Safety Features
Compliant with relevant industry standards and regulations
Rigorous quality control and testing during manufacturing
Compatibility
This connector is compatible with other Hirose BM23 series components, enabling flexible, modular board-to-board interconnect solutions.
Application Areas
Portable electronics
Wearable devices
Automotive electronics
Industrial control systems
Medical equipment
Product Lifecycle
The BM23FR0.6-50DS-0.35V(51) is an active, in-production product. There are no known equivalent or alternative models available at this time. For the most up-to-date information, please contact our website's sales team.