Manufacturer Part Number
BM23FR0.6-20DP-0.35V(51)
Manufacturer
Hirose
Introduction
This Hirose BM23 series rectangular connector is an edge type, mezzanine (board-to-board) connector designed for high-density surface mount applications. It features a compact and low-profile design with a mated height of only 0.6mm, making it suitable for space-constrained electronics.
Product Features and Performance
20 positions with a 0.35mm pitch
2 rows of contacts
Surface mount mounting
Solder retention feature for secure placement
Gold plated contacts with a thickness of 1.97µin (0.050µm)
Height above board of 0.50mm
Product Advantages
Compact and low-profile design for space-saving integration
High-density contact arrangement for increased I/O capacity
Secure solder retention for reliable connections
Gold plated contacts for superior conductivity and corrosion resistance
Key Reasons to Choose This Product
Optimized for high-density, space-constrained applications
Reliable performance with solder retention and gold-plated contacts
Compact and low-profile design for seamless integration
Versatile board-to-board connectivity solution
Quality and Safety Features
Manufactured to high quality standards for reliable performance
Designed and tested to meet industry safety and compliance requirements
Compatibility
This BM23 series connector is compatible with other Hirose BM23 series components and can be used for board-to-board interconnections in a variety of electronic devices and systems.
Application Areas
Smartphones, tablets, and other mobile devices
Wearable electronics
Industrial automation and control equipment
Telecommunications and networking equipment
Medical and healthcare devices
Product Lifecycle
The BM23FR0.6-20DP-0.35V(51) connector is an active and current product in the Hirose BM23 series. There are no known plans for discontinuation at this time. If you have any questions or need assistance finding an alternative or equivalent model, please contact our website's sales team.