Manufacturer Part Number
BM23FR0.6-6DP-0.35V(51)
Manufacturer
hirose
Introduction
This is a high-quality rectangular connector array from Hirose, designed for board-to-board connections in electronic devices. It features a compact, low-profile design and a reliable solder-retention mechanism to ensure secure connections.
Product Features and Performance
Rectangular connector array with 6 positions and 2 rows
35mm pitch for high-density applications
Mated stacking height of 0.6mm for space-constrained designs
Surface mount construction with solder retention for secure mounting
Gold-plated contacts for superior conductivity and corrosion resistance
Compliant with relevant industry standards
Product Advantages
Compact and low-profile design for space-saving integration
Robust solder-retention mechanism for reliable connections
High-quality gold-plated contacts for optimal signal transmission
Suitable for a wide range of electronic applications
Key Reasons to Choose This Product
Exceptional durability and reliability for long-lasting performance
Versatile design that can be easily integrated into various electronic systems
Cost-effective solution for board-to-board connectivity needs
Backed by Hirose's reputation for quality and innovation
Quality and Safety Features
Designed and manufactured to meet industry standards for quality and safety
Robust construction and materials ensure long-term reliability and performance
Compatibility
Compatible with a wide range of electronic devices and systems that require board-to-board connectivity
Application Areas
Suitable for use in a variety of electronic devices, including industrial equipment, telecommunications infrastructure, consumer electronics, and more.
Product Lifecycle
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