MPC745BVT300LE - Freescale Semiconductor

Manufacturer Part Number

MPC745BVT300LE

Manufacturer

NXP Semiconductors

Introduction

Discontinued embedded microprocessor from the MPC7xx series featuring the PowerPC core.

Product Features and Performance

PowerPC core

32-Bit single-core processor

Speed of 300MHz

Surface mount technology

255-BBGA, FCBGA package

Product Advantages

High operating temperature range of 0°C to 105°C

Supports multiple voltage I/O levels (2.5V and 3.3V)

Key Technical Parameters

Core Processor: PowerPC

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 300MHz

Voltage - I/O: 2.5V, 3.3V

Operating Temperature: 0°C to 105°C

Package / Case: 255-BBGA, FCBGA

Supplier Device Package: 255-FCPBGA (21x21)

Quality and Safety Features

Operating temperature specification ensures reliability in various environments

Quality of construction as per NXP standards

Compatibility

Compatible with systems requiring 2.5V or 3.3V I/O voltage levels

Mountable on surfaces that support 255-FCPBGA footprint

Application Areas

Suitable for a wide range of high-temperature industrial applications before discontinuation

Product Lifecycle

Obsolete - recommended to check for end-of-life notices or replacements

Possible existence of upgrades or alternative parts from the same or different series

Several Key Reasons to Choose This Product

Performance stability of the PowerPC core at 300MHz speeds

Handles a wide range of operating temperatures for various environments

NXP Semiconductors' reputation for quality and reliability

Versatility in voltage requirements with both 2.5V and 3.3V I/O compatibility