MPC745BPX350LE - NXP USA Inc.

Manufacturer Part Number

MPC745BPX350LE

Manufacturer

nxp-semiconductors

Introduction

The MPC745BPX350LE is an embedded microprocessor from the MPC7xx series designed for high-performance computing applications.

Product Features and Performance

Core Processor: PowerPC

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 350MHz

Operating Temperature range from 0°C to 105°C

Voltage I/O: 2.5V, 3.3V

Mounting Type: Surface Mount

Package / Case: 255-BBGA, FCBGA

Processor housed in a 255-FCPBGA (21x21) package

Product Advantages

Efficient 32-Bit PowerPC core allowing for robust processing capabilities

Supports moderate temperature range making it suitable for various applications

Compact 255-FCPBGA package enables easier integration into designs

Key Technical Parameters

Core: PowerPC

Speed: 350MHz

Temperature Range: 0°C ~ 105°C

Voltage I/O: 2.5V, 3.3V

Mounting: Surface Mount

Packaging: 255-FCPBGA (21x21)

Quality and Safety Features

Operates effectively within a specified temperature range of 0°C to 105°C ensuring reliability under varying environmental conditions

Compatibility

Utilizes standard surface mount technology for compatibility with general PCB design practices

Application Areas

Designed for use in embedded systems that require high-performance processing capabilities

Product Lifecycle

Status: Obsolete

Alternatives or replacements may need to be considered as the product is nearing discontinuation

Several Key Reasons to Choose This Product

High-performance PowerPC core suitable for demanding applications

Broad operating temperature range suitable for use in varied environmental conditions

Easily integrable surface mount package design

Obsolete status ideal for legacy system maintenance or specialized applications where newer models do not provide requisite compatibility