MPC755BPX300LE - NXP USA Inc.

Manufacturer Part Number

MPC755BPX300LE

Manufacturer

NXP Semiconductors

Introduction

The MPC755BPX300LE is a part of the MPC7xx series, designed as an embedded microprocessor featuring a PowerPC core.

Product Features and Performance

Single Core Processor with 32-Bit Bus Width

Operating speed at 300MHz

Surface Mount Package Type

Packaged in a 360-FCBGA (FCPBGA) format

Operating Temperature ranges from 0°C to 105°C

Supports a Voltage I/O of 2.5V and 3.3V

Product Advantages

High reliability in varying temperature conditions ranging from 0°C to 105°C

Offers a simple, one-core 32-bit architecture for streamlined processing

Key Technical Parameters

Core Processor: PowerPC

Cores/Bus Width: 1 Core, 32-Bit

Speed: 300MHz

Voltage I/O: 2.5V, 3.3V

Operating Temperature: 0°C ~ 105°C

Mounting Type: Surface Mount

Package / Case: 360-BBGA, FCBGA

Supplier Device Package: 360-FCPBGA (25x25)

Quality and Safety Features

Durable design capable of operating in temperatures up to 105°C

Robust surface mount package enhances the product's reliability

Compatibility

Standard 360-FCBGA packaging ensures compatibility with various board layouts

Application Areas

Suitable for embedded processing in industrial applications

Ideal for applications requiring a robust temperature range and simplified processing capabilities

Product Lifecycle

The product is currently classified as Obsolete

No specified replacements or upgrades available

Several Key Reasons to Choose This Product

Dependable performance ensured by the PowerPC core with 300MHz speed

Supports a wide operational temperature range, making it versatile for various industrial applications

Straightforward surface mount installation

Reliable data handling with its 32-bit processing capabilities for embedded systems