NTLJD3119CTBG - onsemi

Manufacturer Part Number

NTLJD3119CTBG

Manufacturer

onsemi

Introduction

Discrete Semiconductor Products

Transistors FETs, MOSFETs Arrays

Product Features and Performance

RoHS3 Compliant

6-WDFN (2x2) package

Surface Mount

Cool series

Tape & Reel (TR) packaging

Operating Temperature: -55°C ~ 150°C (TJ)

Power Max: 710mW

N and P-Channel configuration

Drain to Source Voltage (Vdss): 20V

Rds On (Max) @ Id, Vgs: 65mOhm @ 3.8A, 4.5V

MOSFET (Metal Oxide) technology

Current Continuous Drain (Id) @ 25°C: 2.6A, 2.3A

Input Capacitance (Ciss) (Max) @ Vds: 271pF @ 10V

Logic Level Gate

Vgs(th) (Max) @ Id: 1V @ 250A

Gate Charge (Qg) (Max) @ Vgs: 3.7nC @ 4.5V

Product Advantages

RoHS3 compliance

Compact 6-WDFN (2x2) package

Surface mount for easy integration

Cool series for efficient thermal performance

Wide operating temperature range

Key Technical Parameters

Drain to Source Voltage (Vdss): 20V

Rds On (Max) @ Id, Vgs: 65mOhm @ 3.8A, 4.5V

Current Continuous Drain (Id) @ 25°C: 2.6A, 2.3A

Input Capacitance (Ciss) (Max) @ Vds: 271pF @ 10V

Vgs(th) (Max) @ Id: 1V @ 250A

Gate Charge (Qg) (Max) @ Vgs: 3.7nC @ 4.5V

Quality and Safety Features

RoHS3 compliant

Compatibility

Surface mount design compatible with standard SMT assembly processes

Application Areas

Suitable for a wide range of power management and control applications

Product Lifecycle

Current production, no plans for discontinuation

Replacements and upgrades available as needed

Several Key Reasons to Choose This Product

RoHS3 compliance for environmental responsibility

Compact 6-WDFN (2x2) package for space-constrained designs

Efficient thermal performance with Cool series

Wide operating temperature range for versatility

Competitive technical parameters for power management and control applications