MMBF5460 - onsemi

Manufacturer Part Number

MMBF5460

Manufacturer

onsemi

Introduction

The MMBF5460 is a P-Channel JFET designed for high-performance switching and amplifier applications.

Product Features and Performance

P-Channel JFET transistor

Surface Mount Technology (SMT) for compact integration

High breakdown voltage of 40V for robust operation

Low cutoff voltage at 750mV enables efficient operation

Minimal input capacitance of 7pF at 15V ensuring fast response

Maximum power dissipation of 225mW for reliable continuous operation

Wide operating temperature range from -55°C to 150°C

Product Advantages

Ideal for high-density PCB designs due to SMT packaging

Enhanced reliability under extreme conditions

Low power consumption and efficient switching performance

Effective in circuits requiring high input impedance

Key Technical Parameters

FET Type: P-Channel

Voltage Breakdown (V(BR)GSS): 40V

Current Drain (Idss) @ Vds (Vgs=0): 1mA @ 15V

Voltage Cutoff (VGS off) @ Id: 750 mV @ 1µA

Input Capacitance (Ciss) (Max) @ Vds: 7pF @ 15V

Power Max: 225mW

Operating Temperature: -55°C ~ 150°C (TJ)

Mounting Type: Surface Mount

Package / Case: TO-236-3, SC-59, SOT-23-3

Supplier Device Package: SOT-23-3

Quality and Safety Features

Manufactured by onsemi, a leader in semiconductor technology ensuring high reliability and performance

Compliance with industry-standard quality and safety norms

Compatibility

Compatible with surface mount technology for PCB integration

Application Areas

Amplifiers

Switching applications

Signal processing

High-input impedance circuits in telecommunications and computing

Product Lifecycle

Status: Obsolete

Note: Availability of replacements or upgrades should be checked with onsemi or authorized distributors.

Several Key Reasons to Choose This Product

High reliability and robust operation in extreme conditions

Efficient power management for low power consumption

Versatile for use in a wide range of applications

Offered by onsemi, a reputable manufacturer in the semiconductor industry

Surface mount packaging compatible for modern, compact PCB designs