FAN7382MX - onsemi

Manufacturer Part Number

FAN7382MX

Manufacturer

onsemi

Introduction

High-Voltage Gate Driver IC for IGBT and N-Channel MOSFET drives

Product Features and Performance

Half-Bridge topology support

Independent dual channel operation

Supports Gate driving for IGBTs and N-Channel MOSFETs

High side bootstrap voltage up to 600 V

Peak output current of 350mA (source), 650mA (sink)

Fast rise and fall times (60 ns / 30 ns typical)

Broad supply voltage range (10V to 20V)

Input logic compatible with TTL and CMOS levels (VIL = 0.8 V, VIH = 2.5 V)

Operating temperature range from -40°C to 150°C

Product Advantages

Enhanced ruggedness against negative transient voltage

Low propagation delay

Under-voltage lockout for both channels

3V and 5V input logic compatible

Minimal external components required due to integrated bootstrap diode

Key Technical Parameters

Supply Voltage range: 10V ~ 20V

Logic Voltage levels: VIL 0.8V, VIH 2.5V

Output current capacity: 350mA (Source), 650mA (Sink)

High side voltage (Bootstrap): Max 600V

Temperature range: -40°C ~ 150°C

Quality and Safety Features

High level of integration for reliability

Protection against under-voltage conditions

Robust thermal performance with exposed pad in 8-SOIC package

Compatibility

Suitable for driving N-Channel MOSFET and IGBT devices

Compatible with standard TTL and CMOS logic

Application Areas

Motor control

Power inverters

Power supplies

Inductive heating systems

Renewable energy systems (solar inverters, wind turbines)

Product Lifecycle

Active product status

Not near discontinuation

Assured supply availability for new designs

Several Key Reasons to Choose This Product

Designed for high-voltage, high-efficiency applications

Improved power consumption and energy efficiency

Easy integration into existing and new designs

Proven solution from a reputable manufacturer in Power Management

Comprehensive technical support and extensive application notes available from onsemi

Housed in a small 8-SOP package to minimize PCB space requirements