Manufacturer Part Number
XCVU13P-2FHGA2104E
Manufacturer
Xilinx
Introduction
High-capacity FPGA from Xilinx's Virtex® UltraScale+™ series designed for advanced embedded systems.
Product Features and Performance
Advanced FPGA technology.
Virtex® UltraScale+™ series integration for high performance and functionality.
High logic density with 3,780,000 logic cells.
Extensive memory resources totaling 514,867,200 RAM bits.
Supports 832 I/O pins for flexible connectivity.
Surface mount 2104-BBGA, FCBGA packaging for robust PCB integration.
Product Advantages
Exceptional processing capabilities due to a large number of LABs/CLBs.
Capable of managing complex and demanding applications.
Scalable solution providing a path for future expansions.
Key Technical Parameters
Number of LABs/CLBs: 216,000.
Number of Logic Elements/Cells: 3,780,000.
Total RAM Bits: 514,867,200.
Number of I/O: 832.
Voltage Supply Range: 0.825V ~ 0.876V.
Operating Temperature Range: 0°C ~ 100°C (TJ).
Quality and Safety Features
Rigorous quality control in line with industry standards.
Heat dissipation features for maintaining safe operating temperatures.
Compatibility
Compatible with various industry-standard surface mount technologies and design software.
Application Areas
Data centers.
High-performance computing.
Telecommunications.
Military and aerospace.
Medical electronics.
Product Lifecycle
Currently active product with ongoing manufacturer support.
Typically includes options for future replacements or upgrades as part of the product family.
Several Key Reasons to Choose This Product
High logic and memory resource availability for large-scale projects.
Suitable for a wide range of high-tech applications.
Long-term reliability and manufacturer support.
Comes from Xilinx, a leader in FPGA technology.
Enhanced performance capabilities courtesy of the Virtex® UltraScale+™ architecture.