Manufacturer Part Number
XCVU125-1FLVB1760I
Manufacturer
AMD Xilinx
Introduction
High-performance, power-efficient 16nm Virtex UltraScale FPGA
Product Features and Performance
Massive logic capacity of 1,566,600 logic elements
Abundant on-chip memory of 90,726,400 total RAM bits
Advanced networking and DSP capabilities
Highly flexible and customizable architecture
Product Advantages
Optimized for power-sensitive and high-performance applications
Provides excellent performance and power efficiency
Offers rich set of features and resources for FPGA-based designs
Key Technical Parameters
702 user I/O pins
Operating temperature range of -40°C to 100°C
922V to 0.979V supply voltage
1760-FCBGA package (42.5x42.5mm)
Quality and Safety Features
Lead-free and RoHS compliant
Moisture Sensitivity Level (MSL) of 4 (72 hours)
Compatibility
Seamlessly integrates with Xilinx design tools and ecosystem
Application Areas
High-performance computing
Networking and communications
Video and image processing
Aerospace and defense applications
Product Lifecycle
Currently in active production
No known plans for discontinuation or replacement
Several Key Reasons to Choose This Product
Exceptional logic capacity and on-chip memory for complex designs
Advanced networking and DSP capabilities for cutting-edge applications
Excellent power efficiency and thermal performance
Comprehensive design tools and ecosystem support from Xilinx
Proven reliability and longevity in mission-critical applications
