Manufacturer Part Number
XCVU11P-L2FLGB2104E
Manufacturer
Xilinx
Introduction
High-performance FPGA designed for advanced embedded systems
Product Features and Performance
Embedded FPGA with 2,835,000 Logic Elements/Cells
Massive 396,150,400 Total RAM Bits for extensive data handling
162,000 LABs/CLBs for comprehensive logic block configuration
High I/O count with 572 available for versatile connectivity
Supports a supply voltage range of 0.698V to 0.876V
Optimized for surface mount technology
Operating temperature range from 0°C to 100°C, suitable for industrial applications
Utilizes 2104-BBGA, FCBGA package for efficient integration
Product Advantages
Provides a scalable architecture for high-speed data processing
Features sophisticated clock management and routing for enhanced performance
Suitable for high-density integration due to its compact FCBGA packaging
Offers extensive memory resources to tackle complex computational tasks
Key Technical Parameters
Number of Logic Elements/Cells: 2,835,000
Total RAM Bits: 396,150,400
Number of LABs/CLBs: 162,000
Number of I/O: 572
Supply Voltage: 0.698V ~ 0.876V
Operating Temperature: 0°C ~ 100°C
Quality and Safety Features
Rigorously tested for operational integrity under various conditions
Built with fail-safe mechanisms to ensure reliability
Maintains stable performance within specified temperature ranges
Compatibility
Compatible with a broad range of peripheral devices
Supports multiple voltage standards for I/O interfacing
Integrates seamlessly with Xilinx software tools for design and development
Application Areas
Data centers
High-performance computing
Telecommunications
Aerospace and defense systems
Industrial automation
Product Lifecycle
Product Status: Active
No indication of nearing discontinuation
Replacement and upgrade options are available for future scalability
Several Key Reasons to Choose This Product
Enhanced computational capability with a high number of Logic Elements and LABs
Large memory capacity to support complex designs and applications
Ideal for high-speed, data-intensive processing requirements
Robust thermal and operational design to suit industrial and harsh environments
Wide compatibility and integration support streamline the development process