Manufacturer Part Number
XCKU9P-2FFVE900I
Manufacturer
Xilinx
Introduction
The XCKU9P-2FFVE900I is a high-performance, advanced Kintex® UltraScale+™ FPGA designed for ultimate integration capabilities with enhanced logic density, I/O bandwidth, and DSP processing. Ideal for a wide range of applications from data center acceleration to 5G networking equipment.
Product Features and Performance
Advanced FPGA technology based on Kintex® UltraScale+™ series
High logic density with 599,550 Logic Elements/Cells
Large on-chip memory with Total RAM Bits of 41,881,600
High I/O pin count with 304 I/Os for versatile connectivity
Supports voltage supply from 0.825V to 0.876V
Efficient surface mount design with 900-FCBGA packaging
Enhanced performance at operating temperatures -40°C to 100°C (TJ)
Product Advantages
Superior logic integration for complex digital systems
Extensive memory resources for high-throughput data processing
High configurability of I/O for diverse application needs
Robust thermal and power performance for reliable operation
Simplified board design with FCBGA packaging
Key Technical Parameters
Number of LABs/CLBs: 34260
Number of Logic Elements/Cells: 599550
Total RAM Bits: 41881600
Number of I/O: 304
Voltage Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Quality and Safety Features
Rigorous quality control and testing procedures ensure high reliability
Adherence to safety standards for electronic components
Built to withstand harsh operating environments
Compatibility
Compatible with leading FPGA development and simulation tools
Supports a broad range of voltage levels and signal standards for I/O interfaces
Application Areas
Data center acceleration
5G network infrastructure
High-performance computing (HPC)
Advanced digital signal processing (DSP)
Automotive driver assistance systems (ADAS)
Product Lifecycle
Currently active with ongoing manufacturer support
Not nearing discontinuation, ensuring long-term availability
Replacements or upgrades within the Kintex® UltraScale+™ series are available
Several Key Reasons to Choose This Product
High logic capacity and memory bandwidth for demanding applications
Flexible I/O configuration supports wide-ranging design requirements
Optimized power consumption and thermal management for continuous operation
Extensive development and diagnostic tools from Xilinx and partners
Strong track record of Xilinx in delivering cutting-edge FPGA technology
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