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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XCKU3P-2FFVB676I
XCKU3P-2FFVB676I Image
Image may be representation.
See specifications for product details.

XCKU3P-2FFVB676I - AMD

Manufacturer Part Number
XCKU3P-2FFVB676I
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XCKU3P-2FFVB676I
ECAD Model
Parts Description
IC FPGA 280 I/O 676FCBGA
Detailed Description
Package
676-BBGA, FCBGA
Data sheet
XCKU3P-2FFVB676I.pdf
RoHs Status
ROHS3 Compliant
In stock: 15

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Quantity

Specifications

XCKU3P-2FFVB676I Tech Specifications
AMD - XCKU3P-2FFVB676I technical specifications, attributes, parameters and parts with similar specifications to AMD - XCKU3P-2FFVB676I

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 0.825V ~ 0.876V  
Total RAM Bits 31641600  
Supplier Device Package 676-FCBGA (27x27)  
Series Kintex® UltraScale+™  
Package / Case 676-BBGA, FCBGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature -40°C ~ 100°C (TJ)  
Number of Logic Elements/Cells 355950  
Number of LABs/CLBs 20340  
Number of I/O 280  
Mounting Type Surface Mount  
Base Product Number XCKU3  

Parts Introduction

Manufacturer Part Number

XCKU3P-2FFVB676I

Manufacturer

Xilinx

Introduction

High-capacity, high-performance Kintex UltraScale+ FPGA for embedded applications.

Product Features and Performance

20340 LABs/CLBs for flexible logic implementation

355950 Logic Elements/Cells enable complex designs

31641600 Total RAM Bits to support large memory needs

280 I/Os for extensive external interfacing

Kintex UltraScale+ family offers improved performance and lower power consumption

Product Advantages

Optimized balance of performance and cost

Advanced processing capabilities suitable for a wide range of applications

Scalable and secure FPGA architecture

Key Technical Parameters

Number of LABs/CLBs: 20340

Number of Logic Elements/Cells: 355950

Total RAM Bits: 31641600

Number of I/O: 280

Voltage - Supply: 0.825V to 0.876V

Mounting Type: Surface Mount

Operating Temperature range: -40°C to 100°C (TJ)

Quality and Safety Features

Designed to meet high-quality standards

Reliability under extended operating temperature range

Compatibility

Compatible with Kintex UltraScale+ FPGA family devices

Application Areas

Industrial

Data Centers

Networking

Telecommunications

Automotive

Aerospace and Defense

Product Lifecycle

Active status

No indication of nearing discontinuation

Future replacements or upgrades should align with Kintex UltraScale+ product roadmap

Several Key Reasons to Choose This Product

FPGA offers a superior balance between cost and performance, making it an economical choice for high-speed computing tasks.

High I/O count and large memory cater to advanced, resource-intensive applications.

The wide temperature range makes it suitable for harsh industrial environments.

Integration capabilities within the Xilinx ecosystem allow for continuous development and future-proof design.

Enduring lifecycle and active product status ensure long-term support and availability.

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XCKU3P-2FFVB676I

Product Attribute XCKU3P-2FFVB676I XCKU3P-1FFVB676E XCKU3P-2FFVA676I XCKU5P-1FFVD900E
Part Number XCKU3P-2FFVB676I XCKU3P-1FFVB676E XCKU3P-2FFVA676I XCKU5P-1FFVD900E
Manufacturer AMD AMD AMD AMD
Package / Case 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 900-BBGA, FCBGA
Package Tray Tray Tray Tray
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Number of I/O 280 280 256 304
Number of LABs/CLBs 20340 20340 20340 27120
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)
Voltage - Supply 0.825V ~ 0.876V 0.825V ~ 0.876V 0.825V ~ 0.876V 0.825V ~ 0.876V
Number of Logic Elements/Cells 355950 355950 355950 474600
Series Kintex® UltraScale+™ Kintex® UltraScale+™ Kintex® UltraScale+™ Kintex® UltraScale+™
Base Product Number XCKU3 XCKU3 XCKU3 XCKU5
Supplier Device Package 676-FCBGA (27x27) 676-FCBGA (27x27) 676-FCBGA (27x27) 900-FCBGA (31x31)
Total RAM Bits 31641600 31641600 31641600 41984000

XCKU3P-2FFVB676I Datasheet PDF

Download XCKU3P-2FFVB676I pdf datasheets and AMD documentation for XCKU3P-2FFVB676I - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XCKU3P-2FFVB676I

AMD
32D-XCKU3P-2FFVB676I

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