XCKU3P-2FFVB676E - AMD

Manufacturer Part Number

XCKU3P-2FFVB676E

Manufacturer

Xilinx

Introduction

Xilinx's XCKU3P-2FFVB676E is part of the Kintex® UltraScale+™ series, optimized for high-performance applications in a variety of sectors, including telecommunication, data processing, and aerospace.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array) technology

Enhanced performance for data-intensive applications

Highly flexible and programmable logic architecture

35,5950 logic elements/cells for complex digital processing

20,340 LABs/CLBs providing adaptable logic blocks

31,641,600 total RAM bits for high-capacity data storage

280 configurable I/O pins for flexible connectivity

Product Advantages

High integration capability reduces overall system cost

Low voltage supply operation minimizes power consumption

Superior thermal performance with a permissible operating temperature range from 0°C to 100°C (TJ)

Enhanced system speed and efficiency

Key Technical Parameters

Number of LABs/CLBs: 20340

Number of Logic Elements/Cells: 355950

Total RAM Bits: 31641600

Number of I/O: 280

Voltage Supply: 0.825V ~ 0.876V

Operating Temperature: 0°C ~ 100°C (TJ)

Quality and Safety Features

Manufactured in a highly reliable 676-BBGA, FCBGA package

Rigorous testing ensures performance under specified temperature ranges

Compatibility

Surface Mount mounting type for broad PCB compatibility

676-FCBGA (27x27) package compatible with standard FCBGA mounting processes

Application Areas

Telecommunications systems

Data processing units

Aerospace and avionics

High-performance computing platforms

Industrial automation

Product Lifecycle

Current product status is Active

Not close to discontinuation, ensuring long-term availability and support

Upgrades or replacements readily available within the Kintex® UltraScale+™ series

Several Key Reasons to Choose This Product

Exceptional processing power for data and signal processing applications

High flexibility and programmability to meet evolving project requirements

Robust support and longevity, backed by ongoing manufacturer updates and community resources

Energy-efficient design facilitating lower operational costs

Comprehensive technical and application support from Xilinx