Manufacturer Part Number
XCKU3P-1FFVB676I
Manufacturer
Xilinx
Introduction
The XCKU3P-1FFVB676I is a high-performance FPGA from Xilinx's Kintex® UltraScale+™ series designed for advanced embedded systems integration.
Product Features and Performance
High logic capacity with 20340 LABs/CLBs and 355950 Logic Elements/Cells
Large memory resources totaling 31641600 RAM Bits
Supports 280 I/O pins for extensive connectivity
Operates efficiently between voltage ranges of 0.825V to 0.876V
Supports surface mount technology for better PCB integration
Withstands harsh operating temperatures from -40°C to 100°C
Product Advantages
Optimized for low-power applications
High integration flexibility with surface mount package
Robust temperature tolerance ensuring reliability in variable environments
Key Technical Parameters
Number of LABs/CLBs: 20340
Number of Logic Elements/Cells: 355950
Total RAM Bits: 31641600
Number of I/O: 280
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: -40°C ~ 100°C (TJ)
Packaging Type: 676-FCBGA (27x27)
Quality and Safety Features
Built to withstand industrial operating parameters
Complies with stringent quality assurance standards
Compatibility
Ideal for integration in PCBs with its 676-FCBGA (27x27) supplier device package
Application Areas
Ideal for high-speed data processing, telecommunications, military, and aerospace applications where performance and reliability are critical
Product Lifecycle
Status: Active
Not currently nearing discontinuation
Replacements or upgrades will be available should it be phased out
Several Key Reasons to Choose This Product
Superior logic and memory capacity facilitating complex digital computations
Durable and reliable for use in extreme environmental conditions
Efficient power management contributing to lower operational costs
Easily integrated into existing systems with surface mount compatibility
Part of the widely-used and trusted Xilinx's Kintex® UltraScale+™ series
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