XC3S1400AN-5FGG676C - AMD

Manufacturer Part Number

XC3S1400AN-5FGG676C

Manufacturer

Xilinx

Introduction

The XC3S1400AN-5FGG676C is part of the Spartan®-3AN series, designed for embedded FPGA applications, supplied in a 676-BGA package.

Product Features and Performance

FPGA category - Embedded FPGA

Packaging type - Tray

Number of LABs/CLBs - 2816

Number of Logic Elements/Cells - 25344

Total RAM Bits - 589824

Number of I/O - 502

Number of Gates - 1400000

Voltage Supply range - 1.14V to 1.26V

Mounting Type - Surface Mount

Operating Temperature range - 0°C to 85°C

Package - 676-BGA

Device package - 676-FBGA (27x27)

Product Advantages

High number of logic elements and gates for complex designs

Large RAM capacity for deep memory applications

Broad operating temperature range suitable for varied environments

High I/O pin count for extensive peripheral interfacing

Key Technical Parameters

Voltage Supply: 1.14V - 1.26V

Operating Temperature: 0°C - 85°C

Number of Logic Elements: 25344

Total RAM Bits: 589824

Number of I/O: 502

Quality and Safety Features

Robust surface mount package (676-BGA)

Capable of operating in a broad range of temperatures from 0°C to 85°C

Compatibility

Compatible with surface mount technology for efficient PCB assembly

Application Areas

Suitable for telecommunications, automotive, and industrial control systems

Product Lifecycle

Status: Last Time Buy

Note: Check availability for replacements or upgrades as the product is nearing discontinuation

Several Key Reasons to Choose This Product

Extensive configuration capabilities with 25344 logic elements

Large I/O count (502) enhances peripheral interfacing

High memory density with 589824 total RAM bits allows storage and manipulation of large data sets

Versatile power supply compatibility (1.14V to 1.26V)

Rugged design ensures reliability in variable temperature conditions (0°C to 85°C)