XC3S1400AN-4FG676I - AMD

Manufacturer Part Number

XC3S1400AN-4FG676I

Manufacturer

Xilinx

Introduction

The XC3S1400AN-4FG676I is a highly capable FPGA from Xilinx's Spartan®-3AN series, designed to offer powerful digital processing in a compact and flexible package.

Product Features and Performance

Incorporates 2816 LABs/CLBs for extensive logic operations

Features 25344 logic elements/cells, enabling complex digital circuit design

Equipped with a total of 589,824 RAM bits for high-volume data storage and processing

Provides 502 I/O pins for versatile connectivity options

Designed with 1.4 million gates for robust digital processing capabilities

Supports a supply voltage range of 1.14V to 1.26V for efficient power consumption

Surface mount device, suitable for compact PCB layouts

Operates over a wide temperature range of -40°C to 100°C, ensuring reliability in extreme conditions

Product Advantages

High logic and I/O pin count allows for the integration of complex designs into a single chip

Increased storage capacity with integrated RAM for data-intensive applications

Broad voltage support enhances compatibility with various power supplies

Extended operational temperature range makes it suitable for use in harsh environments

Key Technical Parameters

Number of LABs/CLBs: 2816

Number of Logic Elements/Cells: 25344

Total RAM Bits: 589824

Number of I/O: 502

Number of Gates: 1400000

Voltage Supply: 1.14V ~ 1.26V

Operating Temperature: -40°C ~ 100°C (TJ)

Quality and Safety Features

Manufactured by Xilinx, a renowned leader in the FPGA market, ensuring product reliability and performance

Rigorous quality control and testing standards meet industry safety and quality requirements

Compatibility

676-BGA packaging ensures compatibility with standard surface mount technology for easy integration into a variety of designs

Application Areas

Ideal for high-performance computing, telecommunication infrastructure, automotive electronics, and industrial automation

Product Lifecycle

Marked as Last Time Buy, indicating it is nearing the end of its production life, with replacements or upgrades potentially available

Several Key Reasons to Choose This Product

High-capacity design supports the integration of complex digital systems on a single chip

Flexible I/O options and extensive logic capabilities enable customization for specific applications

Energy-efficient operation and wide temperature range support ensure suitability for energy-sensitive and harsh environmental applications

Backed by Xilinx's reputation for quality, offering assurance in product reliability and support

Its nearing end-of-life status may provide cost advantages for suitable short-term projects or legacy system maintenance