Manufacturer Part Number
XC3S1400AN-4FGG676I
Manufacturer
AMD Xilinx
Introduction
High-performance FPGA in the Spartan-3AN series
Designed for embedded applications requiring low power and high logic density
Product Features and Performance
1,400,000 system gates
25,344 logic cells
589,824 total RAM bits
502 user I/O pins
Supports advanced FPGA features like embedded multipliers, DCM blocks, and SelectIO™ technology
Product Advantages
Optimized for low-power, cost-sensitive applications
Provides high logic density and embedded system-level functionality
Supports a wide range of I/O standards for flexible system integration
Key Technical Parameters
Package: 676-FBGA (27x27)
Mounting Type: Surface Mount
Operating Temperature: -40°C to 100°C (TJ)
Supply Voltage: 1.14V to 1.26V
Quality and Safety Features
RoHS3 compliant
Rigorous quality control and testing processes
Compatibility
Compatible with a wide range of Xilinx design tools and development platforms
Application Areas
Embedded systems
Industrial automation
Medical equipment
Wireless and networking infrastructure
Consumer electronics
Product Lifecycle
Current product offering, not nearing discontinuation
Replacement and upgrade options available within the Spartan-3AN FPGA series
Key Reasons to Choose This Product
High performance and logic density for demanding embedded applications
Low power consumption for energy-efficient designs
Flexible I/O options and system-level features
Proven reliability and quality from a leading FPGA manufacturer
Seamless integration with Xilinx design tools and ecosystem