W29N01HVBINA - Winbond Electronics

Manufacturer Part Number

W29N01HVBINA

Manufacturer

Winbond Electronics Corporation

Introduction

High-performance, high-density NAND Flash memory chip

Suitable for a wide range of embedded applications

Product Features and Performance

High-speed parallel interface with 25ns access time

Supports a wide operating voltage range of 2.7V to 3.6V

Operates in extreme temperatures from -40°C to 85°C

Designed for single-level cell (SLC) NAND Flash technology

Organized as 128M x 8-bit

Product Advantages

Excellent reliability and endurance

Low power consumption

Fast write and read speeds

Wide temperature range support

Key Technical Parameters

Memory Size: 1Gbit

Memory Interface: Parallel

Write Cycle Time: 25ns

Memory Organization: 128M x 8

Quality and Safety Features

RoHS3 compliant

Robust 63-VFBGA (9x11) package

Compatibility

Suitable for a wide range of embedded applications, including industrial, automotive, and consumer electronics

Application Areas

Industrial control systems

Automotive electronics

Portable devices

IoT and edge computing applications

Product Lifecycle

This product is currently in production and available from the manufacturer.

Upgrades and replacements may be available in the future as technology evolves.

Key Reasons to Choose This Product

High-performance and reliability for demanding applications

Wide operating voltage and temperature range

Fast parallel interface for efficient data transfer

Low power consumption for energy-efficient designs

Proven NAND Flash technology with excellent endurance