Manufacturer Part Number
W29N01HVBINA
Manufacturer
Winbond Electronics Corporation
Introduction
High-performance, high-density NAND Flash memory chip
Suitable for a wide range of embedded applications
Product Features and Performance
High-speed parallel interface with 25ns access time
Supports a wide operating voltage range of 2.7V to 3.6V
Operates in extreme temperatures from -40°C to 85°C
Designed for single-level cell (SLC) NAND Flash technology
Organized as 128M x 8-bit
Product Advantages
Excellent reliability and endurance
Low power consumption
Fast write and read speeds
Wide temperature range support
Key Technical Parameters
Memory Size: 1Gbit
Memory Interface: Parallel
Write Cycle Time: 25ns
Memory Organization: 128M x 8
Quality and Safety Features
RoHS3 compliant
Robust 63-VFBGA (9x11) package
Compatibility
Suitable for a wide range of embedded applications, including industrial, automotive, and consumer electronics
Application Areas
Industrial control systems
Automotive electronics
Portable devices
IoT and edge computing applications
Product Lifecycle
This product is currently in production and available from the manufacturer.
Upgrades and replacements may be available in the future as technology evolves.
Key Reasons to Choose This Product
High-performance and reliability for demanding applications
Wide operating voltage and temperature range
Fast parallel interface for efficient data transfer
Low power consumption for energy-efficient designs
Proven NAND Flash technology with excellent endurance