W29N01GZDIBA - Winbond Electronics

Manufacturer Part Number

W29N01GZDIBA

Manufacturer

Winbond Electronics

Introduction

The W29N01GZDIBA is a high-capacity, high-performance NAND flash memory chip from Winbond Electronics. It offers a storage capacity of 1Gbit, organized as 128M x 8, making it suitable for a wide range of embedded applications that require reliable, non-volatile memory.

Product Features and Performance

NAND flash technology with SLC (Single-Level Cell) architecture

Parallel memory interface for fast data transfer

Operating voltage range of 1.7V to 1.95V

Fast access time of 35ns and write cycle time of 35ns

Wide operating temperature range of -40°C to 85°C

Compact 48-VFBGA package for space-efficient design

Product Advantages

High storage capacity in a small footprint

Low power consumption with wide voltage range

Robust performance across a wide temperature range

Reliable and durable non-volatile memory solution

Key Reasons to Choose This Product

Proven reliability and longevity from a trusted manufacturer

Excellent performance characteristics for demanding applications

Versatile compatibility and suitability for a wide range of embedded systems

Cost-effective solution for high-density memory requirements

Quality and Safety Features

Robust design and manufacturing process to ensure long-term reliability

Compliance with industry standards and certifications for safety and quality

Compatibility

Widely compatible with various embedded systems and microcontrollers

Application Areas

Suitable for a variety of embedded applications, such as industrial automation, medical devices, consumer electronics, and more, where high-capacity, reliable non-volatile memory is required.

Product Lifecycle

The W29N01GZDIBA is now an obsolete product, meaning it is no longer in active production. However, Winbond may offer alternative or equivalent models that can provide similar functionality and performance. Customers are advised to contact our website's sales team for more information on available options and product lifecycle status.