Manufacturer Part Number
TC4432COA
Manufacturer
Microchip Technology
Introduction
The TC4432COA is a robust gate driver designed for power management applications.
Product Features and Performance
High current drive capability of 1.5A source and 1.5A sink
Wide supply voltage range from 4.5V to 30V
Fast switching with rise and fall times typically 25ns and 33ns respectively
Suitable for driving N-Channel and P-Channel MOSFETs
Non-inverting input configuration
Supports logic level inputs with thresholds at 0.8V (VIL) and 2.4V (VIH)
High-temperature operational range from 0°C to 150°C (TJ)
Product Advantages
High-side or low-side drivability increases design flexibility
Single-channel output simplifies circuitry for single gate control
Integrated protection features enhance device reliability
Compatible with standard logic levels for ease of interfacing
Surface-mount 8-SOIC package is space-efficient and suitable for modern PCB designs
Key Technical Parameters
Number of Drivers: 1
Gate Type Supported: N-Channel, P-Channel MOSFET
Peak Output Current (Source, Sink): 1.5A
Input Type: Non-Inverting
Voltage - Supply Range: 4.5V - 30V
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Rise/Fall Time (Typical): 25ns/33ns
Operating Temperature Range: 0°C - 150°C
Quality and Safety Features
High reliability and stability over wide temperature range
Built-in protection mechanisms to safeguard against excessive voltage and temperature conditions
Compatibility
Compatible with a broad range of MOSFETs for flexible circuit designs
Standard logic level compatibility for ease of interface with control circuitry
Application Areas
Switching power supplies
Motor controllers
Power inverters
Battery management systems
Product Lifecycle
Active product status with long-term availability
Not nearing discontinuation with support for future design-ins
Several Key Reasons to Choose This Product
Ability to drive high current loads efficiently
Fast switching characteristics to support high-frequency operations
Versatile for both high-side and low-side applications
Robust thermal performance for reliability in harsh environments
Ease of design integration with industry-standard packaging and logic levels