PIC16F1719-I/MV - Microchip Technology

Manufacturer Part Number

PIC16F1719-I/MV

Manufacturer

Microchip Technology

Introduction

An 8-bit microcontroller from the PIC® XLP™ 16F series designed for low-power and high-performance embedded applications.

Product Features and Performance

32MHz maximum operating speed

Embedded I²C, LINbus, SPI, and UART/USART interfaces for connectivity

35 general-purpose I/O lines for flexible peripheral integration

Integrated brown-out detect/reset, power-on reset, PWM modules, and watchdog timer for system reliability

28KB of flash program memory for robust application storage

2KB RAM for efficient data handling

10-bit analog-to-digital converter with 28 channels for precise sensor readings

5-bit and 8-bit digital-to-analog converters for analog signal output

Internal oscillator for standalone operation

Support for software-selectable frequency ranges for flexible clocking

Product Advantages

Reduced power consumption due to XLP (Extreme Low-Power) technology

Ample program memory and RAM support complex embedded applications

Robust peripheral set for versatile system design

Easy to program with Microchip's MPLAB software environment

Key Technical Parameters

Core Processor: PIC

Core Size: 8-Bit

Speed: 32MHz

Program Memory Size: 28KB

RAM Size: 2K x 8

Supply Voltage: 2.3V to 5.5V

Operating Temperature: -40°C to 85°C

Quality and Safety Features

Built-in brown-out detect/reset and watchdog timer for system stability.

Design adherence to industry safety standards.

Compatibility

Compatible with Microchip's development tools and software.

Supports common serial communication protocols.

Application Areas

Consumer Electronics

Automation and Control Systems

Automotive applications

Internet of Things (IoT) devices

Product Lifecycle

Active status; not near discontinuation.

Options for replacements and upgrades available through Microchip's ongoing product development.

Several Key Reasons to Choose This Product

Low-power consumption extends the battery life of portable devices.

High integration reduces the need for additional components, saving space and cost.

Wide operating voltage range increases application flexibility.

Robust internal features ensure reliable operation in extended temperature ranges.

Diverse application support due to extensive I/O and communication protocol support.