PIC16F1718-I/ML - Microchip Technology

Manufacturer Part Number

PIC16F1718-I/ML

Manufacturer

Microchip Technology

Introduction

Embedded microcontroller designed for versatility with a rich feature set in the PIC XLP 16F series

Product Features and Performance

8-bit core processor

Fast operating speed of 32MHz

Supports I2C, LINbus, SPI, UART/USART communication interfaces

Comes with Brown-out Detect/Reset, Power-on Reset, Pulse Width Modulation, and Watchdog Timer peripherals

Offers 24 programmable I/O lines

Program Memory of 28KB (16K x 14)

FLASH program memory type for reliable storage

2K x 8 RAM size for efficient processing

Product Advantages

Optimized for low power consumption with XLP (eXtreme Low Power) technology

High-speed core allows for efficient processing of tasks

Multiple communication interfaces for broad connectivity options

Integrated analog-to-digital converters (17x10b) and digital-to-analog converters (1x5b, 1x8b) for analog integration

Internal oscillator for reduced external components

Suitable for a range of supply voltages from 2.3V to 5.5V

Key Technical Parameters

Core size: 8-Bit

Speed: 32MHz

Number of I/O: 24

Program Memory Size: 28KB

Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V

Data Converters: A/D 17x10b, D/A 1x5b, 1x8b

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Supplier Device Package: 28-QFN (6x6)

Package / Case: 28-VQFN Exposed Pad

Quality and Safety Features

Brown-out Detect and Reset function safeguards against voltage dips

Programmable Watchdog Timer for system recovery and fault protection

Compatibility

Compatible with a broad range of standard communication protocols

Can interface with various sensors and actuators through its I/O pins

Application Areas

Suitable for automotive systems, industrial automation, consumer electronics, and more

Product Lifecycle

Product Status: Active

No indication of nearing discontinuation with replacements or upgrades readily available

Several Key Reasons to Choose This Product

Offers a combination of power efficiency and processing capability

Enhanced connectivity with multiple built-in communication modules

Suited for diverse applications due to its comprehensive features

Stable operation over a wide range of temperatures and supply voltages

Easy integration into system designs with surface-mount technology