TPS65930A2ZCH - Texas Instruments

Manufacturer Part Number

TPS65930A2ZCH

Manufacturer

Texas Instruments

Introduction

The TPS65930A2ZCH is a specialized Power Management Integrated Circuit (PMIC) developed by Texas Instruments, designed to provide comprehensive power management solutions.

Product Features and Performance

Integrated power management for Mobile/OMAP™ platforms

Support for multiple power rails with high efficiency

Low standby current of 300µA, promoting energy saving

Operates across a wide voltage range of 2.7V to 4.5V, ensuring flexibility in various power environments

Engineered for optimal performance in temperatures ranging from -40°C to 85°C

Advanced packaging (139-LFBGA) for robust assembly and reliability

Product Advantages

High integration reduces component count and system complexity

Enhanced power efficiency extends battery life in mobile applications

Broad operating temperature range enhances device reliability in harsh conditions

Key Technical Parameters

Supply Current: 300µA

Supply Voltage: 2.7V to 4.5V

Operating Temperature: -40°C to 85°C

Mounting Type: Surface Mount

Package/Case: 139-LFBGA

Device Package: 139-NFBGA (10x10)

Quality and Safety Features

Built to meet stringent quality standards of Texas Instruments

Includes safety features tailored to protect against over-current and thermal overload

Compatibility

Specifically designed for Mobile/OMAP™ platforms, ensuring seamless integration with OMAP processors

Application Areas

Primarily used in mobile phones and portable devices

Suitable for any device requiring efficient power management and multiple power rails

Product Lifecycle

Currently marked as Active, indicating availability and ongoing manufacturer support

No current indication of nearing discontinuation, providing stability for product planning

Several Key Reasons to Choose This Product

Texas Instruments' reputation for reliability and performance

Low power consumption enhances battery life

Flexible voltage operation suits a wide range of devices

Robust packaging for improved product longevity

Comprehensive power management solution reduces system complexity