Manufacturer Part Number
TPS2551DRVR
Manufacturer
Texas Instruments
Introduction
The TPS2551DRVR, designed by Texas Instruments, belongs to the Power Management Integrated Circuits (PMIC) family, specializing in power distribution switches and load drivers.
Product Features and Performance
General Purpose Switch
Single Output High-Side N-Channel Configuration
On/Off Interface Control
Load Voltage Range: 2.5V to 6.5V
No External Supply Required for Operation
Maximum Output Current: 1.1A
Typical Rds (On): 100mOhm
Non-Inverting Input Type
Slew Rate Controlled for Reduced EMI
Adjustable Current Limiting, Over Temperature, and Under Voltage Lock Out (UVLO) Fault Protection
Product Advantages
High reliability with built-in fault protection
Efficient power distribution with low ON resistance
Flexible for various application needs with adjustable current limiting
Enhanced safety features including over-temperature protection
Simplified Design with no need for external Vcc
Key Technical Parameters
Output Configuration: High Side
Output Type: N-Channel
Voltage Load: 2.5V ~ 6.5V
Current Output (Max): 1.1A
Rds On (Typ): 100mOhm
Operating Temperature Range: -40°C to 150°C (TJ)
Package: 6-WSON (2x2)
Quality and Safety Features
Adjustable Current Limiting
Over Temperature Protection
Under Voltage Lock Out (UVLO)
Compatibility
Suitable for surface mount technology (SMT) with 6-WDFN Exposed Pad Package
Application Areas
USB Ports
Handheld Devices
Portable Electronics Power Management
Consumer Electronics
Product Lifecycle
Not For New Designs indicating nearing end of lifecycle with potential replacements or upgrades to be considered.
Several Key Reasons to Choose This Product
Designed by trusted manufacturer Texas Instruments
Optimal for managing power distribution in compact devices
Offers customizable protection features to enhance device safety
Low resistance path minimizes power loss
Supports a wide range of load voltages accommodating various applications
High-temperature operational capability ensuring performance stability under thermal stress
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