Manufacturer Part Number
SN74LVC1G126DRYR
Manufacturer
Texas Instruments
Introduction
A versatile single-bit non-inverting buffer equipped with a 3-state output from Texas Instruments' 74LVC series, designed for logic-level translation and buffering purposes.
Product Features and Performance
Single-bit buffer with non-inverting logic
3-state output for bus interfacing
Capable of sourcing or sinking up to 32mA
Wide supply voltage range from 1.65V to 5.5V
Low power consumption ideal for battery-operated devices
High noise immunity and low propagation delay
ESD protection exceeds JESD 22
Product Advantages
Compatible with down voltage and up voltage translation
Ability to drive heavily loaded outputs with 32mA capacity
Flexible in interfacing with different voltage systems
Suitable for applications requiring high-speed data transmission
Improved power efficiency benefiting portable applications
Key Technical Parameters
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 1
Current Output High, Low: 32mA
Voltage Supply Range: 1.65V ~ 5.5V
Operating Temperature Range: -40°C ~ 125°C
Quality and Safety Features
Over-temperature protection mechanism
High Electrostatic Discharge (ESD) immunity meeting exceeding industry standards
Compatibility
Compatible with 5V TTL and CMOS logic levels
Surface mount, fitting for compact PCB designs
Application Areas
Data bus buffering or isolation
Logic level translation
Portable electronics
Communication systems
Industrial controls
Product Lifecycle
Status: Active
Further details on product life cycle, obsolescence, and replacement options should be checked with Texas Instruments directly.
Several Key Reasons to Choose This Product
Offers design flexibility due to wide supply voltage compatibility
Ensures robust performance with high ESD immunity and temperature resilience
Compact 6-pin package suitable for space-constrained applications
Industry-standard quality and reliability from Texas Instruments
Active product status ensures long-term availability and support
The device package is optimized for improved thermal performance and small PCB footprint.