Manufacturer Part Number
MSP430FR5964IRGZR
Manufacturer
Texas Instruments
Introduction
The MSP430FR5964 is part of the MSP430™ FRAM series of ultra-low-power 16-bit microcontrollers integrated with FRAM memory, enhanced with advanced peripherals, and designed for power- and space-constrained applications.
Product Features and Performance
16-Bit MSP430 CPUXV2 core delivering up to 16MHz
FRAM Program Memory of 256KB allows for flexible data storage and faster write operations with lower power
8KB RAM facilitates efficient data handling
Comprehensive connectivity including I2C, IrDA, SPI, UART/USART
A/D converter with 16 channels, 12-bit resolution
High number of I/O pins (40) for multifunctional applications
Integral peripherals such as DMA, WDT, PWM, Brown-out Detect/Reset, and Power-on Reset enhance reliability and performance
Product Advantages
Quick data access and modifications due to FRAM technology
Reduces power consumption thanks to FRAM and low-power operational modes
Tailored for demanding operational environments with a wide temperature range and robust interfacing capabilities
Key Technical Parameters
Core Speed: 16MHz
Program Memory: 256KB FRAM
RAM Size: 8KB
I/O Pins: 40
Data Converters: A/D 16x12b
Connectivity: I2C, IrDA, SPI, UART/USART
Operating Voltage: 1.8V to 3.6V
Operating Temperature: -40°C ~ 85°C
Quality and Safety Features
Incorporates Power-on Reset, Brown-out Detect/Reset, and Watchdog Timer for system integrity
Reliable operation ensured by DMA error handling and supply voltage supervision
Compatibility
Compatible with a broad range of sensors and peripheral components due to versatile I/O and connectivity options
Application Areas
Ideally suited for consumer electronics, industrial automation, smart grid infrastructure, and portable medical devices
Product Lifecycle
Currently active with ongoing manufacturer support and no near-term discontinuation; replacements or upgrades are readily available as part of the MSP430™ series
Several Key Reasons to Choose This Product
Ultra-low power consumption fosters energy efficiency in applications
Robust build to withstand harsh temperatures ranging from -40°C to 85°C
Availability of ample memory and high connectivity options provide scalability in complex projects
Supportive of fast development cycles due to easy programmability and advanced integration features