MSP430F2274IDAR - Texas Instruments

Manufacturer Part Number

MSP430F2274IDAR

Manufacturer

Texas Instruments

Introduction

The MSP430F2274IDAR is a 16-bit embedded microcontroller designed for low-power and high-performance applications. It belongs to the MSP430F2xx series and features a variety of connectivity options and peripherals.

Product Features and Performance

Core Processor: MSP430 CPU16

Core Size: 16-Bit

Speed: 16MHz

Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART

Peripherals: Brown-out Detect/Reset, Power-On Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT)

Number of I/O: 32

Program Memory Size: 32KB FLASH (32K x 8 + 256B)

RAM Size: 1K x 8

Data Converters: 12 x 10-bit Analog-to-Digital

Oscillator Type: Internal

Operating Temperature Range: -40°C to 85°C

Product Advantages

Features a diverse range of connectivity options meeting various interface requirements

Equipped with essential peripherals enhancing its functionality and reliability

Optimal for projects requiring low power consumption and high performance

Key Technical Parameters

Program Memory: 32KB FLASH

Operating Voltage: 1.8V to 3.6V

Number of ADC Channels: 12

ADC Resolution: 10 bits

Maximum Clock Speed: 16MHz

Temperature Range: -40°C to 85°C

32 I/O Ports

Quality and Safety Features

Brown-out Detect/Reset ensures the MCU resets during brown-outs

Power-On Reset (POR) initializes the microcontroller properly at power-up

Compatibility

Compatible interface for various protocols such as I2C, UART and SPI

Suitable for integration with various sensors and other embedded devices

Application Areas

Portable medical devices

Consumer electronics

Industrial control systems

Wireless sensing

Automation

Product Lifecycle

Active product status

Not nearing discontinuation

Replacement or upgrade options available as technology evolves

Several Key Reasons to Choose This Product

High-speed 16MHz operation enables faster data processing

Low voltage and power-efficient design ideal for battery-operated applications

Multiple integrated peripherals reduce the need for external components

Wide operating temperature suitable for harsh environments

Extensive connectivity features ensure broad application deployment capabilities