Manufacturer Part Number
MSP430F2274IDAR
Manufacturer
Texas Instruments
Introduction
The MSP430F2274IDAR is a 16-bit embedded microcontroller designed for low-power and high-performance applications. It belongs to the MSP430F2xx series and features a variety of connectivity options and peripherals.
Product Features and Performance
Core Processor: MSP430 CPU16
Core Size: 16-Bit
Speed: 16MHz
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Power-On Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT)
Number of I/O: 32
Program Memory Size: 32KB FLASH (32K x 8 + 256B)
RAM Size: 1K x 8
Data Converters: 12 x 10-bit Analog-to-Digital
Oscillator Type: Internal
Operating Temperature Range: -40°C to 85°C
Product Advantages
Features a diverse range of connectivity options meeting various interface requirements
Equipped with essential peripherals enhancing its functionality and reliability
Optimal for projects requiring low power consumption and high performance
Key Technical Parameters
Program Memory: 32KB FLASH
Operating Voltage: 1.8V to 3.6V
Number of ADC Channels: 12
ADC Resolution: 10 bits
Maximum Clock Speed: 16MHz
Temperature Range: -40°C to 85°C
32 I/O Ports
Quality and Safety Features
Brown-out Detect/Reset ensures the MCU resets during brown-outs
Power-On Reset (POR) initializes the microcontroller properly at power-up
Compatibility
Compatible interface for various protocols such as I2C, UART and SPI
Suitable for integration with various sensors and other embedded devices
Application Areas
Portable medical devices
Consumer electronics
Industrial control systems
Wireless sensing
Automation
Product Lifecycle
Active product status
Not nearing discontinuation
Replacement or upgrade options available as technology evolves
Several Key Reasons to Choose This Product
High-speed 16MHz operation enables faster data processing
Low voltage and power-efficient design ideal for battery-operated applications
Multiple integrated peripherals reduce the need for external components
Wide operating temperature suitable for harsh environments
Extensive connectivity features ensure broad application deployment capabilities
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