Manufacturer Part Number
ADS8328IPW
Manufacturer
Texas Instruments
Introduction
ADS8328IPW is a high-performance, 16-bit Analog to Digital Converter (ADC) suited specifically for high-speed data acquisition, processing systems, and various sensor interfacing.
Product Features and Performance
16-bit resolution
Sampling rate up to 500k samples per second
Dual input channels accepting both differential and single-ended signals
SPI data interface for streamlined communication
Successive Approximation Register (SAR) architecture
Ability to work with an external reference
Product Advantages
High precision conversion improves system accuracy
Fast sampling helps in dealing with rapid signal variations
Versatile input configuration aids compatibility with various sensors
Compact 16-TSSOP package ideal for space-constrained applications
Key Technical Parameters
Number of Bits: 16
Sampling Rate (Per Second): 500k
Number of Inputs: 2
Input Type: Differential, Single Ended
Data Interface: SPI
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Package / Case: 16-TSSOP
Quality and Safety Features
Robust operating temperature range (-40°C ~ 85°C) ensures reliable performance under extreme conditions
Compatibility
Compatible with systems needing high-speed ADC with SPI interface
Flexible digital supply voltage (1.65V ~ 5.5V) enhances compatibility with various digital systems
Application Areas
Data acquisition systems
Sensor interfacing
Portable instrumentation
Digital signal processing
Product Lifecycle
ADS8328IPW is currently active and not nearing discontinuation. Availability of replacements or upgrades should be checked with Texas Instruments as per project necessity.
Several Key Reasons to Choose This Product
High resolution and fast sampling rate ensure detailed and rapid data capture
Supports both differential and single-ended inputs broadening application scope
Efficient SPI interface facilitates easy integration with most microcontrollers
Robust temperature tolerance allows deployment in varied environmental conditions
The compact package size is ideal for high-density PCB designs
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