LFE3-35EA-6FTN256C - Lattice Semiconductor Corporation

Manufacturer Part Number

LFE3-35EA-6FTN256C

Manufacturer

Lattice Semiconductor

Introduction

ECP3 series FPGA designed for high-speed applications

Product Features and Performance

4125 LABs/CLBs for logic implementation

33000 Logic Elements/Cells for complex system designs

1358848 Total RAM Bits for ample data storage

133 Number of I/O for extensive interfacing capabilities

14V ~ 1.26V Voltage Supply range for low power consumption

Surface Mount Technology for modern PCB design

0°C ~ 85°C Operating Temperature range for industrial applications

256-BGA Package for robust and compact integration

256-FTBGA (17x17) Supplier Device Package for high-density board layouts

Product Advantages

Optimized for high-speed signal processing

Supports a variety of logic design requirements

Efficient power consumption for energy-sensitive projects

High I/O count for versatile connectivity

Robust operating temperature suited for diverse environments

Compact package ideal for space-constrained applications

Key Technical Parameters

Number of LABs/CLBs: 4125

Number of Logic Elements/Cells: 33000

Total RAM Bits: 1358848

Number of I/O: 133

Voltage Supply Range: 1.14V ~ 1.26V

Mounting Type: Surface Mount

Operating Temperature Range: 0°C ~ 85°C

Package / Case: 256-BGA

Supplier Device Package: 256-FTBGA (17x17)

Quality and Safety Features

Robust packaging for enhanced durability

Compliance with industry standards for safety and quality

Compatibility

Designed for broad compatibility with various PCB assembly processes

Application Areas

High-speed communication protocols

Signal processing in industrial settings

Advanced control systems

Product Lifecycle

Active product with ongoing support

No indication of nearing discontinuation

Availability of replacements or upgrades within the ECP3 series

Several Key Reasons to Choose This Product

High logic density for implementing sophisticated designs

Abundant memory resources to handle complex data processing

Efficient power usage conducive to energy-sensitive deployments

Ample I/O ports enhancing connectivity and interfacing options

Extended temperature range suitable for varied operating conditions

Compact BGA packaging allowing for smaller form-factor designs