Manufacturer Part Number
EPF10K50EFC256-3N
Manufacturer
Intel
Introduction
This is an Integrated Circuit (IC) device from Intel
It is an Embedded FPGA (Field Programmable Gate Array)
Product Features and Performance
2880 Logic Elements/Cells
40960 Total RAM Bits
360 Number of LABs/CLBs
199000 Number of Gates
191 Number of I/O
Product Advantages
Reprogrammable and customizable logic
Flexible and versatile design
Suitable for a wide range of embedded applications
Key Technical Parameters
256-FBGA (17x17) package
Surface Mount Mounting Type
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 2.3V ~ 2.7V
Quality and Safety Features
Reliable Intel manufacturing process
Stringent quality control measures
Compatibility
Compatible with a variety of embedded systems and applications
Application Areas
Embedded systems
Industrial automation
Telecommunications
Networking
Aerospace and defense
Product Lifecycle
Active product, not nearing discontinuation
Replacement and upgrade options available from Intel
Key Reasons to Choose This Product
Powerful and flexible FPGA capabilities
High logic density and memory resources
Wide operating temperature range
Proven reliability and quality from Intel
Compatibility with various embedded applications