Manufacturer Part Number
EPF10K50BC356-3
Manufacturer
Intel
Introduction
FPGA (Field Programmable Gate Array)
Embedded FPGA device
Product Features and Performance
2880 logic elements/cells
20480 total RAM bits
360 LABs/CLBs
116,000 gates
Product Advantages
Reprogrammable and customizable logic
Flexible hardware design
Reduced time-to-market
Key Technical Parameters
356-BGA (35x35) package
Surface mount
Operating temperature: 0°C to 70°C
FLEX-10K series
246 I/O
Supply voltage: 4.75V to 5.25V
Quality and Safety Features
RoHS non-compliant
Compatibility
Compatible with 356-BGA (35x35) package
Application Areas
Embedded systems
Industrial automation
Consumer electronics
Communications
Product Lifecycle
No information on discontinuation or availability of replacements/upgrades
Key Reasons to Choose This Product
Flexibility and customizability of FPGA design
High logic capacity and memory resources
Reliable Intel quality and performance