Manufacturer Part Number
EP4CE40F23A7N
Manufacturer
Intel
Introduction
Intel Cyclone® IV E series FPGA designed for cost-sensitive, power-efficient applications
Product Features and Performance
39600 Logic Elements/Cells for flexible and complex logic designs
1161216 Total RAM Bits for ample data storage and processing capability
2475 LABs/CLBs to implement a wide range of logic functions
328 I/O pins for extensive interfacing with other components
15V ~ 1.25V core voltage range for low-power operation
Surface Mount 484-BGA packaging for compact design footprint
Cyclone® IV E Series technology for optimized cost and power-efficiency
Product Advantages
High-density logic capabilities in a low-cost FPGA
Energy-efficient architecture reducing power consumption
Ample memory resources for various design needs
Strong I/O count for versatile connectivity
Robust temperature tolerance from -40°C to 125°C
Intel's reputable quality and reliability in FPGA technology
Key Technical Parameters
39600 Logic Elements
1161216 Total RAM Bits
2475 LABs/CLBs
328 Number of I/O
Voltage Supply 1.15V to 1.25V
Operating Temperature -40°C to 125°C
Surface Mount 484-BGA package
Quality and Safety Features
Robust operating temperature range for high reliability
Intel's quality assurance for FPGAs
Lead-free and RoHS-compliant packaging for safety
Compatibility
Compatible with various design tools and software from Intel
Supports industry-standard I/O interfacing protocols
Application Areas
Industrial automation
Telecommunications
Automotive electronics
Consumer electronics
Defense and aerospace
Product Lifecycle
Active product status indicating ongoing production and support
Future discontinuation notices, if applicable, provided in advance by Intel
Replacement and upgrade options maintained by Intel for product longevity
Key Reasons to Choose This Product
Optimized for cost and power-sensitive applications
High configurability to suit a broad range of design specifications
Backed by Intel's industry-leading technology and support
Broad operating temperature range for use in extreme conditions
Significant I/O capacity for comprehensive external interfacing
Easy integration with existing systems due to common packaging standards
Long-term availability and lifecycle support from Intel