Manufacturer Part Number
EP4CE30F23C7
Manufacturer
Intel
Introduction
The EP4CE30F23C7 is part of Intel's Cyclone® IV E series, designed for implementing advanced logic functionalities with its field-programmable gate array technology.
Product Features and Performance
Includes 28848 logic elements/cells and 1803 logic array blocks (LABs).
Equipped with 608256 total RAM bits.
Supports up to 328 input/output ports.
Offers a flexible voltage supply range from 1.15V to 1.25V.
Optimal operating temperature range from 0°C to 85°C.
Features surface mount technology for high-density board assemblies.
Utilizes a 484-ball grid array package (484-BGA).
Product Advantages
High logic and RAM capacity enhances complexity and functionality of designs.
Large number of I/Os allows for versatile interfacing with other components.
Low voltage operation helps in reducing power consumption.
Broad operating temperature range supports deployment in various environments.
Key Technical Parameters
Number of LABs/CLBs: 1803
Number of Logic Elements/Cells: 28848
Total RAM Bits: 608256
Number of I/O: 328
Voltage Supply: 1.15V ~ 1.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Package/Case: 484-BGA
Mounting Type: Surface Mount
Quality and Safety Features
Robust BGA packaging ensures reliable soldering and connectivity.
Designed to meet stringent industry standards for performance and reliability.
Compatibility
Compatible with various EDA software tools for FPGA programming and simulation.
Interoperable with other Cyclone® IV series components.
Application Areas
Widely used in telecommunications, automotive, industrial, and consumer electronics applications.
Suitable for complex digital signal processing, protocol bridging, and data conversion.
Product Lifecycle
The product status is active.
Not near discontinuation; replacements and upgrades are readily available.
Several Key Reasons to Choose This Product
High performance-to-cost ratio suitable for budget-sensitive projects.
Versatile in handling complex logic designs due to high logic cells and memory.
Extensive I/O capacity facilitates easy integration with broad system components.
Stable operation in diverse thermal and electrical conditions.
Supported by Intel's comprehensive technical and customer support.