EP3SE50F780I4N - Intel

Manufacturer Part Number

EP3SE50F780I4N

Manufacturer

Intel

Introduction

The EP3SE50F780I4N is part of Intel's Stratix® III E series of Embedded FPGAs designed for high performance and high density with power efficiency in mind.

Product Features and Performance

High-density integration with 47,500 logic elements

Contains 1,900 Logic Array Blocks (LABs) or Complex Logic Blocks (CLBs)

Features 5,760,000 total RAM bits for extensive data handling

Supports up to 488 input/output ports

Operates efficiently with a voltage supply between 0.86V and 1.15V

Optimized for surface mount technology

Designed for enhanced temperature resilience from -40°C to 100°C (TJ)

Product Advantages

High logic capacity and memory enabling complex programmable solutions

Low voltage operation reduces power consumption

Wide range of I/O support enhances connectivity

Robust thermal range ensuring performance in varied environments

Key Technical Parameters

Number of LABs/CLBs: 1900

Number of Logic Elements/Cells: 47500

Total RAM Bits: 5760000

Number of I/O: 488

Voltage Supply: 0.86V ~ 1.15V

Operating Temperature: -40°C ~ 100°C (TJ)

Package: 780-BBGA, FCBGA

Mounting Type: Surface Mount

Quality and Safety Features

Advanced packaging technology ensuring device integrity and longevity

Rigorous temperature rating ensures reliable operation in harsh conditions

Compatibility

Compatible with diverse range of electronic applications requiring embedded FPGA functionality

Application Areas

Telecommunications

High-speed computing applications

Industrial automation

Military and aerospace technology

Product Lifecycle

Status: Obsolete

Note: Customers should consider migrating to newer FPGA solutions; contact Intel for information on replacement options and upgrades.

Several Key Reasons to Choose This Product

Comprehensive logic and memory resources allow for deployment in complex applications

Exceptional power and thermal management for efficient and reliable usage

Wide adaptability across industry sectors due to numerous I/O interfaces and robust design

Continued support from Intel for migration to next-generation FPGA solutions