Manufacturer Part Number
EP3SE50F780I3N
Manufacturer
Intel
Introduction
High-density, high-performance Stratix III E FPGA for embedded systems
Product Features and Performance
1900 LABs/CLBs for flexible logic implementation
47500 Logic Elements/Cells for complex designs
5760000 Total RAM Bits for extensive data storage
488 I/O Pins for broad connectivity options
Supports 0.86V ~ 1.15V supply voltage for low-power operation
Surface Mount for secure PCB assembly
-40°C ~ 100°C operating temperature range for harsh environments
780-BBGA, FCBGA package for robust integration
Stratix III E series known for high speed and functionality
Product Advantages
Supports high-density logic designs
Adequate memory for data-intensive applications
High I/O pin count enables versatile interfacing
Compatible with a wide range of supply voltages
Suitable for extreme temperature conditions
Intel quality and reliability
Key Technical Parameters
Number of LABs/CLBs: 1900
Number of Logic Elements/Cells: 47500
Total RAM Bits: 5760000
Number of I/O: 488
Voltage - Supply: 0.86V ~ 1.15V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Quality and Safety Features
Complies with industry standards for safety
Extended temperature range for high reliability
Compatibility
Adaptable to multiple voltage standards
Standard FCBGA package compatible with modern PCB technology
Application Areas
Embedded systems
Telecommunications
Automotive
Industrial automation
Consumer electronics
Product Lifecycle
Obsolete
Replacement or upgrade may be required
Consult Intel for the nearest equivalent model
Key Reasons to Choose This Product
Developed by leading semiconductor manufacturer Intel
High performance-to-power ratio for energy-efficient designs
Robust temperature rating for use in challenging environments
Large number of configurable logic elements for complex circuits
Integrated memory for high-speed data processing
High I/O count for versatile system integration