Manufacturer Part Number
EP3C55U484C6N
Manufacturer
Intel
Introduction
The EP3C55U484C6N, part of Intel's Cyclone® III series, is an embedded FPGA designed for high-performance, low-power applications requiring a significant amount of logic processing.
Product Features and Performance
Contains 3,491 Logic Array Blocks (LABs)
Features 55,856 logic elements/cells for versatile digital functions
Provides 2,396,160 total RAM bits for data storage
Offers 327 I/O pins for comprehensive external interfacing
Supports a supply voltage range from 1.15V to 1.25V
Designed for surface mount technology
Product Advantages
High logic density for complex digital processing
Low power consumption enhances power efficiency
Extensive I/O availability for versatile connectivity options
Supports a broad range of digital and mixed-signal applications
Key Technical Parameters
Number of LABs/CLBs: 3491
Number of Logic Elements/Cells: 55856
Total RAM Bits: 2396160
Number of I/O: 327
Voltage Supply: 1.15V ~ 1.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-FBGA
Supplier Device Package: 484-UBGA (19x19)
Quality and Safety Features
Rigorously tested for reliability and durability under various conditions
Complies with industry standards for quality and safety
Compatibility
Compatible with a wide range of peripheral components and standards for versatile system design options
Application Areas
Telecommunications
Automotive systems
Industrial control
Consumer electronics
Medical devices
Product Lifecycle
Status: Active
The product is currently in active production with no immediate plans for discontinuation. Future replacements or upgrades may become available as part of Intel's ongoing development.
Several Key Reasons to Choose This Product
Offers high-density logic processing capability for complex digital systems
Low power consumption makes it ideal for power-sensitive applications
Versatile I/O options and compatibility with various peripherals and systems
Active product lifecycle status ensures long-term availability and support
Engineered and manufactured by Intel, a leader in semiconductor innovation