EP3C5F256C8 - Intel

Manufacturer Part Number

EP3C5F256C8

Manufacturer

Intel

Introduction

Cyclone III FPGA for high-performance, low-power applications with a flexible architecture.

Product Features and Performance

321 Logic Array Blocks (LABs)

5136 Logic Elements/Cells

423936 Total RAM Bits

182 I/O Pins

Surface Mount 256-LBGA

Operating Temperature Range 0°C ~ 85°C (TJ)

Product Advantages

Optimized power consumption

High functionality integration

Suitable for volume applications due to low cost

Extended lifecycle for long-term deployment

Key Technical Parameters

Voltage Supply: 1.15V ~ 1.25V

Mounting Type: Surface Mount

Operating Temperature Range: 0°C ~ 85°C

Supplier Device Package: 256-FBGA (17x17)

Quality and Safety Features

Robust thermal management

Compliance with industry standards for safety

Compatibility

Compatible with various design software

Support for multiple I/O standards

Application Areas

Consumer electronics

Communication devices

Industrial automation

Automotive sector

Product Lifecycle

Active product status

No known discontinuation, with replacements or upgrades available

Several Key Reasons to Choose This Product

Low power, high-density FPGA ideal for cost-sensitive markets

Versatile I/O counts and comprehensive memory integration

Supports a wide range of design requirements

Extensive software and hardware ecosystem provided by Intel

Long-term product support and reliability