Manufacturer Part Number
EP2C8F256C8N
Manufacturer
Intel
Introduction
The EP2C8F256C8N is an embedded FPGA from Intel's Cyclone® II series, designed for versatile and high-performance applications requiring programmable logic solutions.
Product Features and Performance
Integrated with 516 LABs/CLBs for flexible logic implementation.
Contains 8256 Logic Elements/Cells enabling complex logic functions.
Offers 165,888 Total RAM Bits for efficient data storage and manipulation.
Provides 182 I/O pins for extensive peripheral and interface connectivity.
Supports Voltage Supply range from 1.15V to 1.25V for energy-efficient operations.
Features Surface Mount technology for compact and reliable PCB integration.
Product Advantages
High logic density and RAM capacity improve overall application efficiency.
Extensive I/O support enhances system connectivity and expandability.
Low power consumption aids in building energy-efficient systems.
The use of Intel's advanced manufacturing process ensures reliability and performance.
Key Technical Parameters
Number of LABs/CLBs: 516
Number of Logic Elements/Cells: 8256
Total RAM Bits: 165888
Number of I/O: 182
Voltage Supply: 1.15V ~ 1.25V
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FBGA (17x17)
Quality and Safety Features
Manufactured by Intel, ensuring high reliability and performance standards.
Operating temperature range (0°C ~ 85°C) ensures stability across various environmental conditions.
Compatibility
The surface mount 256-LBGA package is compatible with modern PCB assembly techniques.
Wide voltage supply range allows for integration with various power supply designs.
Application Areas
Ideal for telecommunications, automotive systems, consumer electronics, and industrial automation.
Suitable for high-speed signal processing, complex logic implementations, and control applications.
Product Lifecycle
Currently active and not nearing discontinuation.
Supported by Intel, with potential for future upgrades or replacements if technology demand shifts.
Several Key Reasons to Choose This Product
High logic and RAM density facilitate complex and high-performance application development.
Low power consumption ensures efficiency and cost savings in operational expenditure.
Broad operating temperature range expands the scope of application environments.
Supported by Intel's reputation for quality, reliability, and technological advancement.
Future-proofed with active product status and support for upgrades, ensuring long-term viability.