EP2C70F896I8N - Intel

Manufacturer Part Number

EP2C70F896I8N

Manufacturer

Intel

Introduction

Intel's Cyclone II EP2C70 series FPGA designed for embedded applications

Product Features and Performance

Integrated 4276 Logic Array Blocks (LABs)

Rich with 68416 Logic Elements/Cells

Extensive 1152000 Total RAM Bits

High I/O pin count with 622 inputs and outputs

Flexible voltage supply range from 1.15V to 1.25V

Surface Mount Technology for PCB assembly

Operational across wide temperature range of -40°C to 100°C (TJ)

Housed in a 896-BGA package for robust integration

Part of the renowned Cyclone® II FPGA series

Product Advantages

High logic density for complex digital processing

Ample memory for advanced functions and storage

Extensive I/O capacity for connectivity and peripheries

Stable performance in extreme temperature conditions

Supported by Intel's advanced technology and resources

Key Technical Parameters

Number of LABs/CLBs: 4276

Number of Logic Elements/Cells: 68416

Total RAM Bits: 1152000

Number of I/O: 622

Voltage Supply Range: 1.15V ~ 1.25V

Operating Temperature Range: -40°C ~ 100°C (TJ)

Package: 896-BGA

Supplier Device Package: 896-FBGA (31x31)

Quality and Safety Features

Meets stringent Intel quality standards

Thermal performance suitable for high-reliability applications

Safety features adherent to industry standards

Compatibility

Compatible with a broad range of design software and development tools from Intel

Adaptable to various baseboards due to standardized BGA packaging

Application Areas

Embedded systems

Industrial automation

Telecommunications

Automotive electronics

Consumer electronics

Product Lifecycle

Status: Active

Not currently nearing discontinuation

Intel typically offers support with replacements or upgrades as necessary

Several Key Reasons to Choose This Product

Manufactured by Intel, a leader in the semiconductor industry

Offers high-density and high-complexity digital processing capabilities

Extensive memory and I/O options for diverse applications

Capable of operating in harsh and wide temperature environments

Robust package and mounting type suitable for various assembly processes

Strong support and compatibility with development tools and software