Manufacturer Part Number
EP2AGX95EF35C4N
Manufacturer
Intel
Introduction
High-performance, low-power FPGA (Field Programmable Gate Array) for embedded applications
Product Features and Performance
Advanced 28nm process technology
High logic density with 89,178 logic elements
Abundant on-chip memory with 6,839,296 total RAM bits
Flexible I/O with 452 user I/Os
Dual-channel DDR3 memory controller
High-speed SERDES with up to 6.5 Gbps performance
Advanced power management features for low power consumption
Product Advantages
Ideal for a wide range of embedded applications requiring high performance, flexibility, and low power
Scalable platform allows for easy upgrades and design reuse
Optimized for cost-sensitive, space-constrained designs
Key Technical Parameters
Package: 1152-FBGA (35x35)
Operating temperature: 0°C to 85°C
Supply voltage: 0.87V to 0.93V
Arria II GX FPGA series
Quality and Safety Features
RoHS compliant
Rigorous quality control and testing
Compatibility
Compatible with a variety of development tools and ecosystem
Application Areas
Industrial automation and control
Medical imaging and monitoring
Automotive electronics
Communications infrastructure
Military and aerospace systems
Product Lifecycle
Current generation product, no discontinuation planned
Replacement and upgrade options available
Several Key Reasons to Choose This Product
High performance and logic density for advanced embedded applications
Optimized power consumption for energy-efficient designs
Flexible and scalable platform for design reuse and easy upgrades
Comprehensive development tools and ecosystem support
Robust quality and reliability for mission-critical applications