Manufacturer Part Number
EP2AGX95EF29I3N
Manufacturer
Intel
Introduction
High-performance, low-power FPGA for embedded applications
Ideal for industrial, communications, and consumer electronics
Product Features and Performance
89,178 Logic Elements (LEs)
6,839,296 Total RAM Bits
3,747 Logic Array Blocks (LABs)
DDR2/DDR3 SDRAM support
372 user I/O pins
Advanced power management features
Product Advantages
High logic density and performance
Extensive on-chip memory and DSP capabilities
Low power consumption
Flexible I/O interfaces
Key Technical Parameters
Package: 780-FBGA (29x29)
Mounting Type: Surface Mount
Operating Temperature: -40°C to 100°C
Quality and Safety Features
RoHS compliant
Tested and qualified for industrial-grade reliability
Compatibility
Designed for embedded applications
Compatible with a range of development tools and software
Application Areas
Industrial automation and control
Communications and networking equipment
Consumer electronics
Medical devices
Product Lifecycle
Current generation product, no plans for discontinuation
Replacement options and upgrades available
Key Reasons to Choose
High performance and logic density
Low power consumption
Flexible I/O and advanced features
Proven reliability and quality
Extensive ecosystem and development tools support