Manufacturer Part Number
EP2AGX125EF29I3N
Manufacturer
Intel
Introduction
Arria II GX series FPGA for high-performance embedded systems
Product Features and Performance
4964 LABs/CLBs for logic implementation
118143 Logic Elements/Cells for complex digital functions
8315904 Total RAM Bits for extensive data storage
372 Number of I/O for interfacing versatility
Surface Mount technology for PCB assembly
780-BBGA, FCBGA package for robust physical integration
Product Advantages
High logic capacity for demanding applications
Integrated memory for efficient data handling
Multipurpose I/O pins enhancing connectivity options
Key Technical Parameters
Number of LABs/CLBs: 4964
Number of Logic Elements/Cells: 118143
Total RAM Bits: 8315904
Number of I/O: 372
Voltage - Supply: 0.87V ~ 0.93V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 780-BBGA, FCBGA
Supplier Device Package: 780-FBGA (29x29)
Quality and Safety Features
Designed for industrial temperature range operation
Compliance with safety and environmental standards
Compatibility
Interoperable with various Intel FPGA families
Support for industry-standard design and verification tools
Application Areas
Embedded systems within telecommunications, industrial, and automotive sectors
Product Lifecycle
Obsolete status
Potential for availability of replacements or upgrades
Several Key Reasons to Choose This Product
High-density and high-capacity FPGA for complex projects
Extended temperature range for harsh environments
Suitable for high-speed interfaces and digital signal processing
Strong support ecosystem from Intel
EP2AGX125DF25I3NIntelIC FPGA 260 I/O 572FBGA