Manufacturer Part Number
EP2AGX125EF29C6G
Manufacturer
Intel
Introduction
High-performance, low-power FPGA (Field Programmable Gate Array) for embedded applications
Product Features and Performance
118,143 logic elements
8,315,904 total RAM bits
4,964 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks)
372 I/O pins
Supports operating temperature range of 0°C to 85°C
Supply voltage range of 0.87V to 0.93V
Product Advantages
Flexible and reconfigurable design
Low power consumption
High performance and density
Key Technical Parameters
780-FBGA (29x29) package
Surface mount
RoHS compliant
Quality and Safety Features
Rigorously tested for reliability and quality
Compatibility
Designed for use in embedded systems and applications
Application Areas
Industrial automation
Medical equipment
Telecommunications
Military and aerospace systems
Product Lifecycle
Current product offering, no known discontinuation plans
Replacement or upgrade options available from Intel
Key Reasons to Choose This Product
Powerful FPGA capabilities for demanding embedded applications
Efficient power consumption for low-power designs
Flexible and reconfigurable architecture to adapt to changing requirements
Supported by Intel's extensive ecosystem and technical resources