Manufacturer Part Number
EP2A25F672C8
Manufacturer
Intel
Introduction
Integrated Circuit (IC)
Embedded FPGA (Field Programmable Gate Array)
Product Features and Performance
24,320 Logic Elements/Cells
622,592 Total RAM Bits
2,430 Number of LABs/CLBs
2,750,000 Number of Gates
Operating Temperature: 0°C to 85°C (TJ)
Voltage Supply: 1.425V to 1.575V
492 Number of I/O
Product Advantages
Reconfigurable and programmable logic
Flexible design capabilities
Power-efficient performance
Key Technical Parameters
Package: 672-FBGA (27x27)
Mounting Type: Surface Mount
Series: APEX II
Supplier Device Package: 672-FBGA (27x27)
Package Type: Tray
Quality and Safety Features
Meets industrial operating temperature range
Reliable and durable performance
Compatibility
Suitable for embedded systems and applications
Application Areas
Industrial automation
Telecommunications
Medical equipment
Automotive electronics
Consumer electronics
Product Lifecycle
Current product offering, no indication of discontinuation
Replacement or upgrade options available from Intel
Key Reasons to Choose This Product
High-performance reconfigurable logic
Efficient power consumption
Versatile and adaptable for various applications
Proven reliability and quality from Intel
Availability of support and development tools from the manufacturer